MFT 212 - Basic Nanofabrication Processes
Credits: 3
2 Lecture Hours 2 Lab Hours
Prerequisites: Separate application and completion of other program courses.
Co-requisites: MFT 211
Description
This course provides an overview of basic processing steps used in all applications of nanofabrication. Both top-down and bottom-up nanofabrication are included. The majority of the course details a step-by-step description of the equipment and processes needed to fabricate devices and structures such as bio-chips, Complementary Metal Oxide Semiconductor (CMOS) transistors, power devices, Microelectromechanical (MEM) devices and opt-electronic structures. Students learn the similarities and differences in both the equipment and process flows needed in the fabrication of these structures.
Learning Outcomes
Upon successful completion of the course, the student will:
- Recognize and apply proper safety and cleanroom behavior.
- Determine the electrical characteristics of a p-n junction.
- Apply the process of lithography to projects.
- Operate the Veeco Digital Instrument.
- Operate the AFT in contact mode.
- Evaporate Gold features through a shadow mask.
- Describe the importance of process control and contamination.
- Recognize how to exploit the properties of work function and electro-negativity.
- Determine the relative adhesion of different metals on various substrates.
- Examine the etch rates of photoresists.
- Use spectrophotometry.
Listed Topics
- Materials overview
- P-n junctions
- The oxidation furnace
- Chemical vapor deposition
- Plasma etching
- Ion implantation
- Etching
- NPN transistor
- CMOS transistors
- MEM and biomedical devices
Reference Materials
Instructor- approved textbook and materials.
Approved By: Johnson, Alex Date Approved: 05/01/2012
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