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Jul 06, 2025
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MFT 215 - Materials Modification for Nanofabrication Applications
Credits: 3
2 Lecture Hours 2 Lab Hours
Prerequisites: MFT 211 and MFT 212
Co-requisites: MFT 216
Description
This course covers the processing steps used to modify material properties in nanofabrication. Included are applications of nano-scale devices and systems and the resulting chemical, physical, biological or hybrid requirements. Use of diffusion barriers, encapsulation, electromigration control, corrosion control, stress control, wettability and adhesion are studied.
Learning Outcomes
Upon successful completion of the course, the student will:
- Apply proper safety practices to cleanroom operations.
- Operate industry-standard materials modification equipment in a nanofabrication facility.
- Evaluate thermal budget requirements for a typical project.
- Grow gate oxides, field oxides and implants for drain and source regions.
- Use negative photolithography to produce microfluidic devices.
- Describe particle flow in Polydimethylsiloxane (PDMS) channels.
- Recognize materials modification using ion implantation.
- Make angle measurements and correlate these with specified surface treatments.
- Operate a spin coater to apply thin layers to the surface of silicon wafers.
Listed Topics
- Thermal processes
- Surface preparations
- Oxidation fundamentals
- Barrier layer formation
- Alloying
- Grain size and mechanical properties
- Grain size and optical properties
- Materials modifications
- Spin coaters and oxide dopants
Reference Materials
Instructor-approved textbook and materials.
Students who successfully complete this course acquire general knowledge, skills and abilities that align with CCAC’s definition of an educated person. Specifically, this course fulfills these General Education Goals: - Information Literacy
- Technological Competence
Approved By: Dr. Quintin B. Bullock Date Approved: 04/12/2024
Last Reviewed: 04/12/2024
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