MFT 216 - Characterization, Testing of Nanotechnology Structures & Materials
2 Lecture Hours 2 Lab Hours
Prerequisites: MFT 211 , MFT 212
Co-requisites: MFT 215
(Formerly MFT-216) This course examines a variety of measurements and techniques essential for controlling micro and nanofabrication processes. Monitoring techniques such as residual gas analysis, optical emission spectroscopy and end point detection are discussed. Characterization techniques such as scanning electron microscopy x-ray photoelectron spectroscopy, atomic probe methods, optical thin film measurements and resistivity/conductivity measurements are introduced. Basic measurements for yield analysis and process control are stressed.
Upon successful completion of the course, the student will:
- Apply proper safety and cleanroom behavior.
- Select proper measurements to make for yield analysis and process control of the nanofabricated product.
- Operate measurement equipment such as cross section, contact evaluation and transistor characterization.
- Discuss the applications of nanofabrication to Magnetic Force Microsocpy (MFM) and Scanning Tunneling Microscopy (STM).
- Interpret IR-spectra for identifying bonding in materials.
- Recognize Transmission Electron Microscopy (TEM).
- Differentiate between Scanning Electron Microscopy (SEM) and TEM in imaging.
- Operate SEM and Atomic Force Microscopy (AFM).
- Evaluate image analysis and process software.
- Plasma process monitoring
- Residual gas analysis
- Ellipsometry and profilometry
- Electron microscopy
- Scanning probe microscopy
- Fluorescence microscopy
- Infrared spectroscopy
- Oxide electrical charactization
- Transistor characteristics
Instructor-approved textbook and materials.
Approved By: Johnson, Alex Date Approved: 05/01/2012
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